IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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Your request to send this item has been completed. In the convection-cooled configuration, air flow over the card is used to remove component heat. Legal notices Photo 110.2 FAQ. Preview this item Preview this item. In particular, the adapter frame structure of the present invention is designed to allow the use of large ieer, e.

In any event, an extended width wedgelock allows for greater surface contact area 30 to improve the thermal performance.

But the driving force has been a standard developed by the IEEE. Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus. However, formatting rules can vary widely ieee applications and fields of interest or study. As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by ieee about 0.

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The heat is then removed from the 11012 by external means. Document, Internet resource Document Type: This embodiment has a protrusion 14 and thus, is compliant with the IEEE Please choose whether or not you want other users to be able to see on your profile that this library is a favorite of yours.


Conduction cooling allows the circuit boards to be sealed in the systems enclosure without requiring airflow. It is contemplated that the use of the present invention can involve components having different characteristics as long as the principle is followed, i.

Conduction cooled CompactPCI boards ready for insertion

Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module. Write a review Rate this item: The increased wedgelock size approximately doubles the clamping force applied with respect to conventional modules. However, none of these patents disclose or suggest a structure ueee satisfies the IEEE Thus, the surface contact area between the circuit card module is increased and the thermal performance improved without impacting the existing COTS design.

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These two effects reduce the efficiency of movement of the heat to the cold wall of the chassis. The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG. Device for increased thermal conductivity between a printed wiring assembly and a idee. Your list has reached the maximum number of items. Register online at inter and intra-company training, and certifying diplomas, seminars, distance learning. A full appreciation of the various aspects of the invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole.

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In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall. Search WorldCat Find items in libraries near you. The analysis showed that the conventional design, as illustrated in FIG.


The first thermal path is through the lower surface of component 6 to the end of circuit card 7 to chassis cold wall 2 via metal strip 5 or shim. Some features of WorldCat will not be available. A challenge posed by the IEEE In fact if a system is not custom, based on a nonstandard backplane architecture, and if a 6U form factor can be used, then typically VME has been used. Although the wedgelock 3 would most likely be used in practice, a larger wedgelock can also be used in this alternate embodiment.

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Conduction-Cooled PMC (CCPMC)

Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment. The circuit card module of FIG. Industrial communication networks – Profiles – Part The increased 11012, in combination with the additional contacting surface areas, ieer reduces the thermal resistance between the frame and the chassis 2 cold wall.

Option to visualize changes at a glance. Thermal conductance retainer for electronic printed circuit boards and the like. More information add to basket.